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Welcome to the nand_programmer wiki!

Table of contents

1. PCB
2. Board components
3. Soldering
4. Burn firmware

PCB

• Download Gerber files from Google Drive release/nando-x.x.x/PCB/gerber/
• Register on one of the PCB manufacture websites, for example, https://jlcpcb.com/
• Create order and load gerber files.
• Configure PCB parameters as in following example:
  
  

The received PCBs:

Board components

The release directory on Google Drive contains a BOM.html (bill of materials) file. The file has a list of required parts for the device. BOM.html provides https://www.farnell.com/ references so you can find parts by ID and order on this website or find analog on local store.

The device is based on STM32F103VCT6 in LQFP100 package with 256KB flash and 48KB SRAM. The other MCUs are not supported because firmware HAL supports only current family. In some cases it is not theoretically possible to port to another MCU due to flash memory size (<256 KB) or missing FSMC as in STM32F103Vx.

The crystal is in HC49-SD package, 8MHz and 18pF load capacitance. If clystal with the same load capacitance is missing the other one can be taken. The values of load capacitors should be fixed as follows:
Cl1 = Cl2 = 2 * (Cl - Cs) = 2 * (18pF - 3pF) = 30pF
Cl1 = Cl2 = 2 * (Cl - Cs) = 2 * (16pF - 3pF) = 26pF.

Resistors, capacitors, LEDs are in the 0805 package. Pinheaders with 2.54mm step.
Parts for adapters are not included in the BOM file but it is just a few pinheaders and TSOP-48 socket. TSOP-48 socket can be bought on https://www.ebay.com. Another option is to order a TSOP-48 adapter for TL866.

Soldering

The board can be soldered using regular soldering iron. The only requirement is to clean flux (even if it is "no-clean") by chemicals such as "kontakt u" or ultrasonic bath. Otherwise there will be high stray capacitance and the device will not work as expected. The schematic is available on Google Drive release directory.

Burn firmware

The device firmware is burned using ST-Link V2.

To be continued...